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    Name: Dicyandiamide-Electronic Grade
    Molecular Formula: C2H4N4
    Molecular Weight: 84.08
    CAS No.: 461-58-5
    EC Code: 207-312-8
    HS Code: 29262000
    Appearance: White Crystal
    Application: Use as curing agent for epoxy resin adhesive in FR-4 CCL production.
    Packing: net 25kg paper and plastic compound bags.

    Store: In a cool, dry, well ventilated warehouse, and keep away from moisture.
    Main Item Index:

    Purity

    %≥

    Moisture

    %≤

    Ash Content

    %≤

    Calcium Content PPM ≤

    Iron Content

    PPM ≤

    Melting Point

    99.8

    0.20

    0.02

    25

    2

    209-212

     

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